Samsung Electronics and ASML have announced a significant expansion of their strategic partnership, aiming to enhance collaboration in High NA EUV lithography and cutting-edge semiconductor manufacturing technologies. This initiative is designed to support the burgeoning demands of the AI era and drive the next generation of innovations in semiconductor technology.
The partnership builds on years of successful cooperation between the two companies, focusing on accelerating the development and deployment of technologies that address the increasing performance and efficiency needs of advanced semiconductor manufacturing. One of the key elements of this collaboration is Samsung's decision to participate in an industry initiative aimed at advancing the next-generation 12-inch photomask technology, transitioning from the long-standing 6-inch photomask format. This shift is poised to significantly enhance fabrication productivity, lower chipmaking costs, and eliminate stitching constraints, thereby allowing advanced chip manufacturers to fully exploit the benefits of High NA EUV technology.
Samsung's extensive experience in both memory and foundry manufacturing, coupled with its expertise in advanced EUV lithography, positions the company to play a vital role in facilitating this transition to 12-inch photomask technology. The company will collaborate closely with industry partners to develop the necessary mask technologies and supporting infrastructure that will enable this advancement.
Furthermore, Samsung plans to integrate ASML's High NA extreme ultraviolet (EUV) lithography into its future DRAM high-volume manufacturing by 2028—a pioneering move within the industry. This incorporation of High NA technology is expected to extend the roadmap for DRAM scaling, improving resolution while simplifying processes and enhancing efficiency.
The announcement underscores a mutual commitment to innovation and technological leadership, reaffirming the long-term partnership between Samsung and ASML. Both companies look forward to exploring further collaboration opportunities in advanced memory technologies and innovative manufacturing techniques.
Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics, emphasized that the AI era is fundamentally transforming the semiconductor industry, heightening the need for technological innovation throughout the value chain. He reiterated Samsung's dedication to maintaining leadership in advanced semiconductor manufacturing through groundbreaking technologies and robust partnerships. By strengthening ties with ASML, he stated, Samsung is helping to lay the groundwork for the next wave of AI and semiconductor innovation.
Christophe Fouquet, President and CEO of ASML, reflected on the enduring relationship between the two companies, highlighting their role in advancing technologies that underpin modern semiconductor manufacturing. He noted that as the industry enters a new era characterized by artificial intelligence, the significance of close collaboration with customers becomes increasingly crucial. ASML anticipates a productive partnership with Samsung in enabling the upcoming wave of semiconductor advancements.
ASML is recognized as a leading supplier to the semiconductor industry, providing the hardware, software, and services necessary for chipmakers to mass-produce integrated circuit patterns. Together with its partners, ASML drives the advancement of more affordable, powerful, and energy-efficient microchips, ultimately facilitating groundbreaking technologies that address a variety of global challenges in healthcare, energy conservation, mobility, and agriculture. Headquartered in Veldhoven, Netherlands, ASML employs over 44,000 individuals worldwide and is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. Those interested can explore ASML's products, technology, and career opportunities at their official website.
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